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Minutes of the Forward Endcap EMC Vibe/eZuce meeting, 20th of September 2021, 14:00-15:15
Forward endcap backlid redone by laser welding company, very good result, maybe front lid also redone (problems: 0.8 mm aluminum, stiffener frame already glued to old front lid - removable?)
Transportation insurance for ISEG module shipment to Radeberg available, Tobias will deliver the HV modules to ISEG
Next Revision of Bonn HV boards is foressen to be irradiated at Strahlenzentrum Giessen (however, currently problems with control electronics at the Strahlenzentrum)
Coating for HV board (moisture insulation of components) by UV-ray curing "Dimax multicure adhesive"?
For the final version of the HV board we need to decide whether FET or BJT circuit seems to better suit our needs (different long term irradiation effects)
Latest fluence/dose considerations show a stable ADC operation period of twice the PANDA lifetime
Christoph will transport the next submodules (5 to Bonn, 5 for repair back to Bochum) when coming to Bochum with Vinee for cable length determination
5 submodules accidently delivered to Juelich will be brought back to Bochum on Sept. 29th by Claudius et. al.
6- and 15-SADC crate aluminum parts now available
Backplane PCB pilot prodution agreed between Uppsala and Bochum (10.5 kEUR w/o power supplies), all backplanes, power supplies and controllers will add up to 60...70 kEUR
For (preliminary) power supplies to operate the crates in cooling tests 3 kEUR more is needed
- 04 Oct 2021
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Topic revision: r1 - 2021-10-04,
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