Minutes of the forward endcap EMC eZuce SRN meeting, 17th of February 2017, 14:00-15:15

Presence:

• Basel: Werner
• Bochum: Cathrina, Claudius, Matthias, Malte, Miriam, Tom, Tobias T.
• Bonn: Christoph and more...
• Groningen: Myroslav
• Stochholm: -
• Uppsala: -
• Giessen: Hans and more...
• GSI: -

Patch Panel Board (aka Schmidt Board):

• Connector for I2C bus chosen: "telecommunications type"
• Main I2C dissipation power source: termination resisitors
• Problem: LV connection - no feasible connector found (size), idea of breakout boards for LV distribution
• LP cabling: rad hardness, halogen free, shielding(?)
• Skip shielding of LV inside forward endcap in order to gain space and number of suitable cable types?
• We will meet with some people from Bonn and Bochum to discuss those cabling issues in detail apart from forward endcap meeting

Serial Adapter Chips (GSI):

• Chips delivery expected end of next week
• Bonding to be done in Bonn (PI/Dietsche)

ADC Cooling Crates:

• Design ready (Myroslav)
• Awaiting finished backplane design (Pawel)

Shaping Time/Pile-Up Recovery Studies (Malte):

• "Small" pulses (from cosmics in horizontally suspended crystal) recorded for waveform check:
  • Two groups of pulse shapes:
    • Shape like the one of 'large' pulses
    • Shape showing a slower compont 'on top' of steep rise
• Not seen with large pulses (as coming from cosmics in vertically suspended crystals), however, not explicitly looked for...
• Origin not clear: hum, Cherenkov light, hadronic showers?
• Fraction of about 10 percent of pulses recorded
• Repeat measurement with 2nd crystal and/or plastics in coincidence
• Plot pulse height histos for both pulse shape groups