Tests with shrinking tube around the crystal cover foils in order to firmly press it to the crystal surface not very promising
Problem is the chamfer on all crystal edges: The foil will be pressed to the edges and is never touching the surfaces, regardless of how hard you shrink or wrap (tried also tape...)
Backward endcap colleagues are going to test crystal covers including the chamfers in the crystal cover shape
Is it possible to precisely fold those covers without braking the foil at the edges?
Is the precision of the covers good enough?
The tolerances of the chamfers are stated to be quite high ('please add the values here!')
Mainz will try to get first prototypes of 'chamfered covers' until the December meeting
While re-equipping the crystals in the VPTT unit prepared to be shipped to Bonn we lost two valve-crystal connections!
There is no idea where it comes from. We will modify the cleaning procedure prior to glueing by changing the cleaning solvent to the specially recommended Dow Corning fluid
As with the APD unit the broken coupling is always the glue-crystal connection
ADCs:
There are two ADC+digitizer units available to be delivered to Giessen and Mainz
However, they will be needed in Giessen first for the preparation of the MAMI beamtime in December
Bonn workshop can manufacture the ADC crates, financing has to be clarified